The **ATS-09D-97-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Product Type** | push-PIN™ Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Base Dimensions** | 45mm x 45mm | | **Height** | 12.7mm | | **Fin Pattern** | Straight | | **Attachment Method** | push-PIN™ with Spring | | **Thermal Resistance** | 20.30 °C/W (Unducted @ 100 LFM) | --- ### 2. Key Features and Construction #### A. Fin Design (Straight-Fin) The "Straight-Fin" design is optimized for environments where airflow is directed through the fins. This geometry provides a high surface area-to-volume ratio, ensuring efficient heat transfer from the base to the surrounding air. #### B. Push-PIN™ Attachment Unlike adhesive-based heat sinks, this model uses a mechanical **Push-PIN** system. * **Engagement:** A pre-assembled plastic or brass pin is pushed through pre-drilled holes in the PCB. * **Compression:** A stainless steel spring provides consistent pressure across the interface, ensuring optimal contact with the electronic component. * **Reliability:** This method is vibration-resistant and allows for easy removal and re-application during maintenance. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heat sink comes with **T766** thermal interface material (phase change material) pre-applied to the base. This fills microscopic air gaps between the component and the heat sink to lower thermal resistance. --- ### 3. Applications This specific heat sink is commonly used in: * **Telecommunications:** Network switches and routers. * **Embedded Computing:** High-speed processing units. * **Power Electronics:** Voltage regulators and power modules. * **Industrial Controls:** Motor drivers and automation hardware. --- ### 4. Thermal Performance Overview Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 20.30 | | 300 (1.5 m/s) | 6.67 | | 500 (2.5 m/s) | 4.17 |