ATS-09D-99-C2-R0
AI

## Technical Overview: ATS-09D-99-C2-R0
The **ATS-09D-99-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). While it is a mechanical component, it is a critical "part" of electronic systems, specifically designed for thermal management of semiconductors like CPUs, FPGAs, and GPUs.
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### 1. Key Technical Specifications
The part number encodes specific physical and thermal characteristics:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (High Thermal Conductivity) |
| **Finish** | Blue Anodized (Enhances corrosion resistance/emissivity) |
| **Dimensions** | 45.00mm x 45.00mm |
| **Height** | 20.00mm |
| **Attachment Type** | pushPIN™ (Spring-loaded attachment) |
| **Thermal Resistance** | 11.52°C/W @ 100 LFM (Linear Feet per Minute) |
| **Thermal Interface** | T766 (Pre-applied Phase Change Material) |
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### 2. Electronic Application & Function
Although passive, this part performs the following functions in an electronic assembly:
* **Heat Dissipation:** It increases the surface area of a power-generating electronic component to transfer heat to the ambient air via convection.
* **pushPIN™ Technology:** The "R0" at the end of the part number signifies the use of the pushPIN™ attachment system. This ensures a precise, high-pressure connection between the heat sink and the chip, minimizing the **Thermal Contact Resistance**.
* **Thermal Interface Material (TIM):** The **T766** pre-applied material fills microscopic air gaps between the chip and the aluminum, significantly improving heat flow efficiency.
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### 3. Thermal Performance Matrix
The efficiency of the ATS-09D-99-C2-R0 depends on the airflow (velocity) within the electronic enclosure:
| Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 11.52 |
| 200 | 1.0 | 4.03 |
| 300 | 1.5 | 2.50 |
| 400 | 2.0 | 1.96 |
| 500 | 2.5 | 1.66 |
---
### 4. CAD & Mounting Dimensions
If you are designing a PCB for this part, the following mechanical data is essential:
```text
Width: 45.0mm
Length: 45.0mm
Height: 20.0mm
Pitch (Hole-to-Hole): 38.0mm
Pin Material: Brass / Plastic Options
```
- ⤷
What are the advantages of the T766 thermal interface material compared to standard grease?
- ⤷ How do I calculate the required airflow for this heat sink in a custom enclosure?
- ⤷ Does this specific model support different spring tensions for delicate electronic components?