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  • ATS-09D-99-C2-R0

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    ## Technical Overview: ATS-09D-99-C2-R0 The **ATS-09D-99-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). While it is a mechanical component, it is a critical "part" of electronic systems, specifically designed for thermal management of semiconductors like CPUs, FPGAs, and GPUs. --- ### 1. Key Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (High Thermal Conductivity) | | **Finish** | Blue Anodized (Enhances corrosion resistance/emissivity) | | **Dimensions** | 45.00mm x 45.00mm | | **Height** | 20.00mm | | **Attachment Type** | pushPIN™ (Spring-loaded attachment) | | **Thermal Resistance** | 11.52°C/W @ 100 LFM (Linear Feet per Minute) | | **Thermal Interface** | T766 (Pre-applied Phase Change Material) | --- ### 2. Electronic Application & Function Although passive, this part performs the following functions in an electronic assembly: * **Heat Dissipation:** It increases the surface area of a power-generating electronic component to transfer heat to the ambient air via convection. * **pushPIN™ Technology:** The "R0" at the end of the part number signifies the use of the pushPIN™ attachment system. This ensures a precise, high-pressure connection between the heat sink and the chip, minimizing the **Thermal Contact Resistance**. * **Thermal Interface Material (TIM):** The **T766** pre-applied material fills microscopic air gaps between the chip and the aluminum, significantly improving heat flow efficiency. --- ### 3. Thermal Performance Matrix The efficiency of the ATS-09D-99-C2-R0 depends on the airflow (velocity) within the electronic enclosure: | Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 11.52 | | 200 | 1.0 | 4.03 | | 300 | 1.5 | 2.50 | | 400 | 2.0 | 1.96 | | 500 | 2.5 | 1.66 | --- ### 4. CAD & Mounting Dimensions If you are designing a PCB for this part, the following mechanical data is essential: ```text Width: 45.0mm Length: 45.0mm Height: 20.0mm Pitch (Hole-to-Hole): 38.0mm Pin Material: Brass / Plastic Options ```
    ✨ Follow-up Questions
    • ⤷ What are the advantages of the T766 thermal interface material compared to standard grease?
    • ⤷ How do I calculate the required airflow for this heat sink in a custom enclosure?
    • ⤷ Does this specific model support different spring tensions for delicate electronic components?