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  • ATS-09F-35-C2-R0

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    The **ATS-09F-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It is part of the "push pin" series designed for securing the cooling element directly to a Printed Circuit Board (PCB). --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 36.83mm x 36.83mm | | **Height** | 10.00mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 22.48°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (High performance) | --- ### 2. Key Component Features #### A. Fin Design The ATS-09F-35-C2-R0 utilizes a **fine-pitch fin design**. This maximizes the surface area for heat dissipation while maintaining a low profile (10mm), making it ideal for compact electronic enclosures where vertical space is limited. #### B. Push-Pin Attachment Instead of using messy adhesives or permanent solder, this part uses a **Brass Push-Pin** mechanism with a stainless steel spring. * **Benefits:** Provides consistent pressure for optimal thermal contact and allows for easy removal/rework. * **Hardware:** It typically uses a 3.0mm diameter hole in the PCB. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766 phase-change material**. This eliminates the need for manual thermal paste application, ensuring a uniform layer that fills microscopic air gaps between the component (CPU/GPU/FPGA) and the heat sink. --- ### 3. Application Use Cases This heat sink is commonly found in: * **Telecommunications:** Cooling high-speed data processors. * **Embedded Systems:** Protecting microcontrollers in industrial automation. * **Networking:** Cooling chips in routers and switches. * **Power Electronics:** Managing heat for VRMs (Voltage Regulator Modules). --- ### 4. Part Number Breakdown (Nomenclature) `ATS` - `09` - `F` - `35` - `C2` - `R0` * **ATS:** Manufacturer (Advanced Thermal Solutions). * **09:** Product Series. * **F:** Fin pitch/style. * **35:** Dimensions (approximate footprint). * **C2:** Material/Color code (Aluminum/Blue Anodized). * **R0:** Revision/Packaging code.
    ✨ Follow-up Questions
    • ⤷ How do I calculate if the 22.48°C/W thermal resistance is sufficient for my chip?
    • ⤷ What are the PCB hole requirements for the push-pin mounting?
    • ⤷ How does 'Blue Anodized' finish affect thermal performance compared to bare aluminum?