The **ATS-09G-101-C2-R0** is a high-performance electronic cooling component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to Printed Circuit Boards (PCBs). ### 1. Key Technical Specifications The following table outlines the physical and thermal properties of this specific part number: | Specification | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Base Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 6.69°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm | | **Fin Type** | Fine Pitch (straight fin pattern) | --- ### 2. Physical Design and Functionality The ATS-09G-101-C2-R0 is engineered to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or power transistors. * **Fin Design:** It uses a high-density straight fin design. This maximizes the surface area, allowing more air to pass through and carry heat away from the component. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766 phase-change material**, which fills microscopic gaps between the chip and the heat sink base to ensure optimal thermal conductivity. * **Attachment:** The "Push-Pin" mechanism uses a spring-loaded pin. This provides consistent pressure (preload) against the chip, which is critical for maintaining a stable thermal connection even during mechanical shock or vibration. --- ### 3. Part Number Breakdown (Nomenclature) To understand exactly what you are ordering, the part number can be decoded as follows: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **09** | Series / Product Type (pushPIN™) | | **G** | Material Type (Aluminum) | | **101** | Specific Model / Dimensions Identifier | | **C2** | Thermal Interface Material (T766) and Performance grade | | **R0** | RoHS Compliant / Revision Status | --- ### 4. Application Considerations When integrating this part into an electronic design, consider the following: * **Airflow Direction:** Performance is highly dependent on airflow (LFM - Linear Feet per Minute). If the system is passively cooled (no fan), the thermal resistance will be much higher. * **PCB Clearance:** Ensure there are no SMD components within the radius of the push-pin holes on the PCB. * **Height Profile:** At 30mm tall, this is a mid-to-high profile heat sink; ensure it fits within the vertical clearance of your enclosure. ---