Based on the part number **ATS-1038-C3-R0**, this component is a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. Specifically, it belongs to the *maxiFLOW™* line, designed for cooling electronic components like BGA (Ball Grid Array) packages. ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Extruded) | | **Finish** | Blue Anodized | | **Attachment Method** | maxiGRIP™ (Spring clip + Plastic frame) | | **Thermal Resistance** | ~1.60 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 23mm | | **Compliance** | RoHS and REACH Compliant | --- ### 2. Physical Design & Construction * **maxiFLOW™ Geometry:** The heat sink features a tapered fin design. This profile increases the surface area for heat dissipation while reducing pressure drop, making it highly efficient in forced-air environments (systems with fans). * **Aluminum Body:** Provides high thermal conductivity for rapid heat transfer from the electronic chip to the cooling fins. * **Blue Anodized Coating:** This is not just for aesthetics; the anodization increases surface emissivity, aiding in radiant heat transfer and providing corrosion resistance. --- ### 3. Mounting Mechanism: maxiGRIP™ The "R0" designation typically refers to the assembly version using the **maxiGRIP™** attachment system. This is a critical electronic hardware feature: 1. **Plastic Frame Clip:** A high-strength plastic frame is placed around the electronic component. 2. **Stainless Steel Spring Clip:** A "steady-spring" clip snaps over the heat sink and locks into the plastic frame. 3. **Advantages:** * Eliminates the need for drilling holes in the PCB. * Provides uniform pressure for optimal interface with **Phase Change Materials (PCM)** or thermal tape. * Protects the component during mechanical shock and vibration. --- ### 4. Application Use Cases These parts are typically found in high-reliability electronic systems: * **Telecommunications:** Cooling high-speed processors and ASICs in routers/switches. * **Embedded Computing:** Industrial PC CPUs. * **Power Supplies:** Heat dissipation for MOSFET arrays. --- ### 5. Summary Table | Part Component | Description | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **1038** | Specific Series/Profile Identifier | | **C3** | Thermal Interface Material (TIM) or Fin density code | | **R0** | Revision/Packaging standard | ---