The **ATS-1042-C3-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** designed for cooling integrated circuits (ICs) like CPUs, GPUs, or FPGAs. Below is a detailed breakdown of its specifications and electronic application characteristics. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) with Brass Springs | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 2.15 °C/W @ 200 LFM | | **Dimensions (L x W x H)** | 40mm x 40mm x 23mm | | **Mounting Hole Pattern** | 33mm (Distance between pins) | --- ### Key Electronic Components & Features #### 1. Thermal Interface Material (TIM) The "R0" suffix typically denotes that the part comes pre-applied with a **Thermal Interface Material**. In this case, it usually features **Chomerics T766**, a high-performance phase-change material that ensures minimal thermal contact resistance between the electronic chip and the aluminum base. #### 2. Attachment Mechanism: Push-Pins and Springs Unlike adhesive tapes, this part uses a mechanical fastening system: * **Push-Pins:** Made of durable plastic (usually Nylon), designed to snap into pre-drilled holes on the PCB. * **Compression Springs:** Brass springs provide a consistent, high-pressure downward force (compression) to ensure the heat sink remains in flat contact with the chip, even under mechanical vibration or thermal expansion. #### 3. Straight-Fin Geometry The straight-fin design is optimized for **forced air convection**. In an electronic enclosure where fans provide a directed airflow path, the straight channels allow air to flow through the fins with low pressure drop, maximizing heat dissipation from the component. #### 4. Blue Anodized Finish The blue coating is not just aesthetic; anodization increases the **emissivity** of the aluminum. This improves the part's ability to dissipate heat through radiation, and it also provides an electrically non-conductive layer to prevent short circuits if the sink accidentally touches nearby surface-mount components. --- ### Application in Circuit Design This part is commonly used on: * **Network Switches/Routers:** For cooling ASICs. * **Industrial PCs:** For cooling chipsets or embedded processors. * **Power Electronics:** Where high-wattage components require a secure, long-term mounting solution that won't degrade like thermal tape.