The **ATS-10A-182-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "maxiFLOW™" series, designed for cooling high-power electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Dimensions** | 36.83 x 36.83 x 17.78 mm | | **Thermal Resistance** | 3.65 °C/W @ 200 LFM | | **Attachment Method** | pushPIN™ | | **Flow Pattern** | maxiFLOW™ (Optimized for Airflow) | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Key Design Features #### A. maxiFLOW™ Geometry Unlike standard extruded heat sinks, the maxiFLOW™ design features a spread fin pattern. This increases the surface area and reduces pressure drop, allowing air to circulate more effectively through the fins. #### B. pushPIN™ Attachment The part utilizes the **pushPIN™** mounting system. This is a secure mechanical attachment that includes: * A flexible spring-loaded pin. * Precise pressure to ensure optimal contact between the heat sink and the component. * Ease of installation compared to traditional adhesive-only methods. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates it comes pre-applied with **T766 thermal phase-change material**. This eliminates the need for manual thermal paste application and ensures a low-resistance path for heat to transfer from the chip to the aluminum fins. --- ### 3. Application Use Cases This specific heat sink is typically used in the following electronic environments: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial PCs:** Compact embedded systems that require passive or active cooling. 3. **Power Supplies:** Cooling MOSFETs or power ICs in tight spaces.