The **ATS-10A-75-C3-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components such as processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table highlights the core technical attributes of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Thermal Resistance** | 1.80°C/W @ 200 LFM | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 24.13mm | | **Pressure Drop** | 0.28 (in-H2O) @ 200 LFM | --- ### 2. Key Electronic Features #### A. Thermal Management (maxiFLOW™ Design) The part features a "flared fin" geometry. Unlike standard straight-fin heat sinks, the flared fins increase the surface area and create more turbulence in the airflow. This leads to significantly higher cooling efficiency (thermal performance) in constrained spaces. #### B. maxiGRIP™ Attachment System This part uses a specialized mechanical attachment rather than thermal tape or epoxy. - **The Frame Clip:** A plastic frame clips onto the component (e.g., a BGA package). - **The Spring Clip:** A "steady spring" provides a consistent, high-pressure interface between the heat sink and the chip. - **Advantage:** This allows for easy removal and re-attachment without damaging the PCB or the electronic component. #### C. Material and Coating - **Blue Anodized Aluminum:** The blue coating is not just aesthetic; anodization increases thermal emissivity and protects the aluminum from corrosion. - **Thermal Interface Material (TIM):** Typically, these units come pre-assembled with a high-performance thermal pad (Phase Change Material) on the base to ensure low thermal resistance between the silicon and the metal. --- ### 3. Usage Context In electronic design, the **ATS-10A-75-C3-R0** is used when a component generates more heat than ambient air can dissipate. It is commonly found in: * **Networking Hardware:** Routers, switches, and base stations. * **Computing:** High-speed memory controllers and mid-range CPUs. * **Industrial Power:** Power supplies and motor controllers. ---