The part number **ATS-10A-91-C2-R0** refers to a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 10mm | | **Attachment Type** | Push-Pin (Plastic) | | **Thermal Resistance** | 21.90°C/W (Natural Convection) | | **Fin Style** | Straight Fin | | **Compliance** | RoHS Compliant | --- ## 2. Part Number Breakdown Understanding the nomenclature helps identify the specific features of this assembly: * **ATS**: Advanced Thermal Solutions (Manufacturer). * **10A**: Refers to the specific attachment style (Push-pin type). * **91**: Indicates the fin geometry and height (10mm). * **C2**: Refers to the thermal interface material (TIM) and color. "C2" typically indicates a Blue Anodized finish. * **R0**: Revision/Packaging code. --- ## 3. Key Features ### A. Thermal Interface Material (TIM) This heat sink usually comes pre-applied with **ATS-PPS-02** or a similar phase-change material. This ensures low thermal resistance between the heat source and the aluminum surface without needing external thermal paste. ### B. Push-Pin Attachment The "10A" series utilizes a plastic push-pin and spring mechanism. * **Pressure:** The spring provides consistent pressure on the component, improving heat transfer. * **Ease of Use:** It allows for quick installation into pre-drilled holes on the PCB. ### C. Low Profile With a height of only **10mm**, this heat sink is designed for space-constrained applications where vertical clearance is limited (e.g., 1U servers or thin embedded systems). --- ## 4. Typical Applications * **Embedded Systems:** Cooling small-form-factor processors. * **Telecommunications:** Cooling ASICs in networking switches. * **Power Supplies:** Heat dissipation for high-power transistors.