The **ATS-10B-02-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~6.07°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Breakdown #### A. The Heat Sink Body The body is constructed from aluminum for its high thermal conductivity-to-weight ratio. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection against corrosion and slightly improves radiant heat transfer. #### B. The Push-Pin Attachment The "-R0" suffix denotes the specific attachment kit. * **Mechanism:** Uses a brass push-pin with a stainless steel spring. * **Benefit:** This provides a secure, consistent downward pressure (clamping force) onto the electronic chip, which ensures maximum contact with the Thermal Interface Material. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * **Purpose:** To fill microscopic air gaps between the chip surface and the heat sink base. * **Advantage:** Eliminates the need for manual thermal paste application, reducing assembly time and errors in production. --- ### 3. Thermal Performance Profile The effectiveness of the ATS-10B-02-C2-R0 depends on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 6.07 | | **400 (2.0 m/s)** | 3.91 | | **600 (3.0 m/s)** | 3.17 | --- ### 4. Typical Applications * **Telecommunications:** Cooling of high-speed networking chips. * **Embedded Systems:** Industrial PCs where space is limited but heat dissipation is critical. * **Power Supplies:** Managing heat for MOSFETs or power regulators.