The **ATS-10B-07-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "push-pin" attachment family designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The part number encodes specific mechanical and material properties. Below are the core technical specifications: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | | **Fin Type** | Straight Fin | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | --- ### 2. Physical Design and Cooling Efficiency The ATS-10B-07-C3-R0 is designed for **forced air** environments (where a fan is present). * **Heat Sink Material:** High-grade aluminum provides a lightweight solution with excellent thermal conductivity ($k \approx 205 \text{ W/mK}$). * **Blue Anodized Coating:** The blue anodization is not just aesthetic; it provides a layer of electrical insulation and increases surface emissivity, slightly improving radiation heat transfer. * **Thermal Resistance:** This model is optimized for low-profile applications. Its efficiency varies based on airflow (measured in Linear Feet per Minute - LFM): * **@ 200 LFM:** $\approx 4.10$ °C/W * **@ 500 LFM:** $\approx 2.30$ °C/W --- ### 3. Attachment Mechanism: Push-Pin and Spring One of the key features of this part is the **Push-Pin** mounting system: 1. **Uniform Pressure:** The brass push-pins combined with compression springs ensure a constant, predefined pressure on the chip. This minimizes air gaps between the heat sink and the component. 2. **Ease of Assembly:** These are designed for pre-drilled holes in the PCB, allowing for quick installation and removal without specialized tools. 3. **Vibration Resistance:** The spring-loaded mechanism makes it suitable for industrial or mobile applications where mechanical vibration is a concern. --- ### 4. Thermal Interface Material (T412) The part comes with **T412** pre-applied to the base. * **Function:** It fills the microscopic air gaps between the component surface and the heat sink base. * **Performance:** T412 is a high-performance phase-change material or tape that offers low thermal impedance and is optimized for heat transfer. --- ### 5. Common Applications * **Processors (CPU/GPU):** Small form-factor embedded processors. * **ASICs/FPGAs:** Logic gates that generate significant heat during operation. * **Telecommunications:** Networking hardware like routers and switches. * **Industrial Controls:** Power electronics requiring stable operating temperatures.