The **ATS-10B-08-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ## 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-10B-08-C3-R0 | | **Material** | Aluminum (with Blue Anodized Finish) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 14.61°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Interface Material** | T412 (High-performance Thermal Grease) | --- ## 2. Key Electronic Features ### A. maxiFLOW™ Design The heat sink features a unique **flared fin geometry**. Unlike standard straight-fin heat sinks, this design maximizes the surface area for convection while minimizing pressure drop, allowing for more efficient heat dissipation in systems with limited airflow. ### B. pushPIN™ Attachment Instead of using messy adhesives or fragile clips, this part uses the **pushPIN™ system**. * **Mechanical Stability:** It provides a precise "bite" into the PCB. * **Uniform Pressure:** A built-in compression spring ensures the thermal interface material (TIM) is pressed firmly and evenly against the electronic chip, which is critical for low thermal resistance. ### C. Thermal Interface Material (TIM) The "C3" in the part number indicates the specific thermal interface material applied to the base. It uses **T412**, which is a high-quality thermal grease that fills microscopic air gaps between the chip and the heat sink base to facilitate faster heat transfer. --- ## 3. Component Dimensions & Airflow The performance of this electronic part varies significantly based on the velocity of the air passing through it (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 14.61 | | 300 (1.5 m/s) | 6.68 | | 500 (2.5 m/s) | 4.66 | --- ## 4. Typical Applications * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Voltage regulators and power modules that generate significant heat in a small footprint.