The **ATS-10B-11-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-10B-11-C2-R0 | | **Heat Sink Type** | Push-Pin (Spring Loaded) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 50.0mm x 50.0mm x 10.0mm | | **Thermal Resistance** | 18.78°C/W (Natural Convection) | | **Airflow Path** | Cross-Cut (Omnidirectional) | | **Thermal Interface Material** | T766 (High Performance) | --- ### 2. Design and Component Features ### ### A. Fin Geometry (Cross-Cut) The unit features a **straight fin/cross-cut** design. Unlike longitudinal fins that require airflow from a specific direction, cross-cut fins allow for multi-directional airflow. This is critical in cramped server chassis or consumer electronics where air turbulence is unpredictable. ### ### B. Attachment Mechanism (Push-Pin) The **"10B"** series designation indicates the use of brass push-pins with a plastic compression spring. * **Ease of Assembly:** No screws or screwdrivers are required; it snaps into pre-drilled PCB holes. * **Constant Pressure:** The spring mechanism ensures consistent pressure on the component, optimizing the contact between the chip and the heat sink. ### ### C. Thermal Interface Material (TIM) The **"C2"** suffix specifies that the heat sink comes pre-applied with **T766 thermal grease**. This reduces assembly time and ensures that the air gaps between the component and the aluminum base are minimized for better thermal conductivity. --- ### 3. Application Use Cases * **Telecommunications:** Cooling of high-speed network switches and routers. * **Embedded Systems:** Industrial PCs where vertical clearance is limited (10mm height). * **Power Supplies:** Cooling of MOSFETs or voltage regulators in compact power modules. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 10.28 | | 400 (2.0 m/s) | 5.33 | | 600 (3.0 m/s) | 4.22 | | 800 (4.0 m/s) | 3.64 |