The **ATS-10B-12-C2-R0** is a high-performance electronic thermal management component specifically categorized as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to the **maxiFLOW™** series. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Base Dimensions** | 54.12mm x 51.27mm | | **Height (Off Base)** | 17.78mm | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 1.58°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Features This part is designed for high-density electronic cooling where airflow direction is critical. * **maxiFLOW™ Geometry:** The heat sink features a tapered fin design that increases the surface area for heat dissipation while minimizing the pressure drop. * **pushPIN™ Attachment:** It uses a specialized mounting system that includes a high-performance compression spring and a "push-pin" mechanism. This ensures consistent pressure on the processor or chip to maximize heat transfer. * **Thermal Interface Material (TIM):** The unit comes with **T766** phase-change material already applied to the base. This eliminates the need for manual thermal paste application and ensures a reliable thermal bond. * **Material and Finish:** The blue anodized aluminum provides both corrosion resistance and improved emissivity. --- ### 3. Application Use Cases This part is typically found in environments with forced-air cooling (fans) such as: * **Telecommunications:** Cooling of ASICs and FPGAs. * **Data Centers:** High-performance servers and networking switches. * **Embedded Systems:** Industrial computers requiring stable thermal profiles. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 1.58 | | 400 (2.0 m/s) | 1.07 | | 600 (3.0 m/s) | 0.88 |