The **ATS-10B-15-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 20mm | | **Thermal Resistance** | 3.44°C/W (at 200 LFM) | | **Attachment Method** | Brass Push Pins (Plastic Pins optional) | | **Spring Type** | Compression Spring | | **Thermal Interface (TIM)** | T766 (High Performance Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **10B**: Designates the series and fin pattern (typically "straight fin" or "cross-cut"). * **15**: Designates the specific height (in this case, 20mm total height). * **C2**: Indicates the specific thermal performance grade and material (Aluminum/Blue Anodized). * **R0**: Version control or revision code (Standard production). --- ### 3. Key Electronic Cooling Functions This part is critical for maintaining the **Thermal Design Power (TDP)** of electronic components. 1. **Heat Dissipation:** It increases the surface area of the heat-generating component, allowing air to carry away heat more efficiently via convection. 2. **Pressure Management:** The integrated push-pins ensure a specific, uniform pressure is applied to the chip, which is vital for the **Thermal Interface Material (TIM)** to work correctly without cracking the silicon die. 3. **EMI Shielding:** Because it is made of aluminum, it can provide minor electromagnetic interference shielding for the component directly beneath it. --- ### 4. Implementation Example When integrating this into a PCB design, the layout engineer must account for the hole pattern required by the push pins. ```c // Design Constraints for ATS-10B-15-C2-R0 PCB_Hole_Diameter = 3.2mm; // Typical for push pin attachment Keepout_Zone = 47.0mm; // Accounting for push pin overhang Thermal_Path = Die -> TIM -> Aluminum Base -> Fins -> Ambient Air; ``` ---