The **ATS-10B-155-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the *maxiFLOW™* series manufactured by Advanced Thermal Solutions (ATS). Below is the breakdown of its specifications and electronic application characteristics. --- ### 1. Technical Specifications | Feature | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum (with Blue Anodized finish) | | **Attachment Method** | pushPIN™ (Spring-loaded attachment) | | **Dimensions** | 40mm x 40mm x 20mm | | **Thermal Resistance** | 5.37°C/W (at 100 LFM) to 1.50°C/W (at 700 LFM) | | **Airflow Pattern** | Spread Fin (maxiFLOW™) | --- ### 2. Key Electronic Components & Features #### A. The Fin Design (maxiFLOW™) Unlike standard straight-fin heat sinks, this part uses a **spread-fin** geometry. This design increases the surface area and encourages turbulent airflow, which is more effective at removing heat from high-power electronic components like CPUs, GPUs, or FPGAs. #### B. pushPIN™ Attachment System The "10B" and suffix "R0" indicate the use of the **pushPIN™** assembly. - **Hardware:** It includes a brass or plastic pin with a stainless steel spring. - **Benefit:** This ensures consistent pressure (clamping force) on the electronic chip, which optimizes the thermal interface material (TIM) performance and prevents the heat sink from shifting during vibration. #### C. Thermal Interface Material (TIM) The "C2" designation typically refers to the **T766** phase-change thermal interface material being pre-applied to the base of the heat sink. This eliminates the need for manual thermal paste application, ensuring a low-resistance thermal path from the silicon to the aluminum. --- ### 3. Application Use Cases This specific part is used for cooling mid-range heat-generating components in the following sectors: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial PC:** Embedded systems that require passive or forced-air cooling. 3. **Power Electronics:** Transistor modules or voltage regulators that generate significant heat in a small footprint. --- ### 4. Thermal Performance Data | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 5.37 | | 300 (1.5 m/s) | 2.50 | | 500 (2.5 m/s) | 1.85 | | 700 (3.5 m/s) | 1.50 |