The **ATS-10B-161-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and other surface-mount components. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-10B-161-C2-R0 | | **Heat Sink Type** | Push-Pin (Passive Cooling) | | **Material** | Aluminum | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 4.74°C/W (at 100 LFM) | | **Dimensions** | 45mm x 45mm x 20mm | | **Attachment Method** | Push-Pin with Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Components and Features #### 1. Push-Pin Attachment Mechanism This part uses a specific mechanical attachment system rather than adhesive tape. * **Plastic Push-Pins:** Designed to fit into pre-drilled holes on a Printed Circuit Board (PCB). * **Compression Springs:** Provide a precise, consistent amount of downward pressure on the electronic component, ensuring optimal contact between the chip and the heat sink. #### 2. Fin Configuration (Straight Fin) The "Straight Fin" design is optimized for environments with **unidirectional airflow**. The fins are parallel, allowing air to pass through the length of the sink to carry away heat. #### 3. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** The "C2" in the part number refers to the blue anodized surface treatment. Anodizing protects the aluminum from corrosion and slightly increases emissivity for better radiant heat transfer. #### 4. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This material fills the microscopic air gaps between the heat sink and the electronic chip (such as a CPU, GPU, or FPGA), significantly reducing thermal resistance. --- ### Application Usage This part is commonly found in: 1. **Telecommunications:** Cooling line cards and routers. 2. **Embedded Computing:** Protecting high-speed processors on industrial motherboards. 3. **Power Supplies:** Dissipating heat from MOSFETs or large power ICs.