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  • ATS-10B-17-C2-R0

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    The **ATS-10B-17-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. --- ## 1. Technical Specifications This part is manufactured by **Advanced Thermal Solutions (ATS)** as part of their "pushPIN™" series. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 15.44°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 12.70mm | | **Fin Configuration** | Fine Pitch (Cross-Cut) | --- ## 2. Key Component Analysis ### A. The Heatsink Body The core component is an extruded aluminum block with a **cross-cut fin design**. This design increases the surface area exposed to the air, allowing for efficient heat dissipation through convection. The low profile (12.7mm) makes it ideal for dense PCB layouts. ### B. Attachment Mechanism: pushPIN™ Unlike adhesive-based heatsinks, this model uses a mechanical fastening system: * **Brass Push Pins:** These snap into pre-drilled holes on the PCB. * **Stainless Steel Springs:** Provide precise, consistent pressure (clamped force) across the thermal interface to ensure maximum heat transfer. ### C. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates the type of interface material. In this series, it usually comes pre-applied with a **T766 phase-change material** or a high-performance thermal pad, ensuring no air gaps exist between the component and the heatsink. --- ## 3. Usage Context This part is commonly used in the following electronic applications: * **Processors (CPUs/GPUs):** For localized cooling in embedded systems. * **FPGAs & ASICs:** High-speed logic chips that generate significant heat. * **Telecommunications:** Cooling networking hardware where space is limited. --- ### Part Number Breakdown ```text ATS - 10 B - 17 - C2 - R0 | | | | | | | | | └── Thermal Interface Material | | | └─────── Color/Finish (C2 = Blue Anodized) | | └──────────── Height (17 = 12.7mm) | └───────────────── Attachment Type (B = pushPIN™) └─────────────────────── Manufacturer (Advanced Thermal Solutions) ```
    ✨ Follow-up Questions
    • ⤷What is the difference between ducted and unducted thermal resistance?
    • ⤷ Does this heatsink require specific PCB hole diameters?
    • ⤷ Can the pushPIN be replaced with a different attachment method?