ATS-10B-17-C2-R0
AI

The **ATS-10B-17-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components.
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## 1. Technical Specifications
This part is manufactured by **Advanced Thermal Solutions (ATS)** as part of their "pushPIN™" series.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 15.44°C/W (Unducted Flow @ 100 LFM) |
| **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 12.70mm |
| **Fin Configuration** | Fine Pitch (Cross-Cut) |
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## 2. Key Component Analysis
### A. The Heatsink Body
The core component is an extruded aluminum block with a **cross-cut fin design**. This design increases the surface area exposed to the air, allowing for efficient heat dissipation through convection. The low profile (12.7mm) makes it ideal for dense PCB layouts.
### B. Attachment Mechanism: pushPIN™
Unlike adhesive-based heatsinks, this model uses a mechanical fastening system:
* **Brass Push Pins:** These snap into pre-drilled holes on the PCB.
* **Stainless Steel Springs:** Provide precise, consistent pressure (clamped force) across the thermal interface to ensure maximum heat transfer.
### C. Thermal Interface Material (TIM)
The "R0" at the end of the part number typically indicates the type of interface material. In this series, it usually comes pre-applied with a **T766 phase-change material** or a high-performance thermal pad, ensuring no air gaps exist between the component and the heatsink.
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## 3. Usage Context
This part is commonly used in the following electronic applications:
* **Processors (CPUs/GPUs):** For localized cooling in embedded systems.
* **FPGAs & ASICs:** High-speed logic chips that generate significant heat.
* **Telecommunications:** Cooling networking hardware where space is limited.
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### Part Number Breakdown
```text
ATS - 10 B - 17 - C2 - R0
| | | | |
| | | | └── Thermal Interface Material
| | | └─────── Color/Finish (C2 = Blue Anodized)
| | └──────────── Height (17 = 12.7mm)
| └───────────────── Attachment Type (B = pushPIN™)
└─────────────────────── Manufacturer (Advanced Thermal Solutions)
```
- ⤷What is the difference between ducted and unducted thermal resistance?
- ⤷ Does this heatsink require specific PCB hole diameters?
- ⤷ Can the pushPIN be replaced with a different attachment method?