The **ATS-10B-170-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (with Blue Anodized finish) | | **Base Dimensions** | 45mm x 45mm | | **Height (Fin)** | 25mm | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Electronic Features ### Thermal Efficiency The "C2" in the part number indicates a specific thermal performance profile. The heat sink uses a **fine-pitch fin design** (cross-cut) which maximizes surface area. This is critical for high-density electronic assemblies where airflow might be limited or directional. ### Attachment Mechanism (pushPIN™) Unlike adhesive-based heat sinks, the ATS-10B-170-C2-R0 uses a mechanical push-pin system: * **Compression Springs:** These ensure precise pressure is applied to the electronic component, optimizing the contact between the chip and the heat sink. * **Reliability:** Mechanical mounting is preferred in high-vibration environments (like automotive or industrial servers) compared to thermal tape. ### Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. In electronics, the TIM is vital because it fills microscopic air gaps between the heat source and the aluminum, significantly lowering thermal resistance. --- ## 3. Physical Layout (Dimensions) | Dimension | Value (mm) | | :--- | :--- | | **Length (A)** | 45.00 | | **Width (B)** | 45.00 | | **Height (C)** | 25.00 | | **Pitch (E)** | 38.00 | | **Pitch (F)** | 38.00 | --- ## 4. Typical Applications This specific part is commonly found in: 1. **Networking Equipment:** Routers and switches where ASICs generate significant heat. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Cooling MOSFETs or power modules in DC-DC converters.