The **ATS-10B-184-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** designed by Advanced Thermal Solutions (ATS). It is engineered for cooling electronic components such as CPUs, GPUs, and high-density power modules. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Attribute | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 4.14 °C/W (at 200 LFM) | | **Pressure Drop** | 0.26 in-H₂O (at 200 LFM) | --- ### 2. Physical Dimensions Precise sizing is critical for PCB layout and clearance between other electronic parts. | Dimension | Measurement | | :--- | :--- | | **Width / Length** | 40mm x 40mm | | **Height** | 25mm | | **Push-Pin Pitch** | 47mm | | **Spring Type** | Compression Spring | --- ### 3. Key Electronic Functions While the heat sink itself is passive, its role in an electronic circuit is vital: * **Thermal Dissipation:** It increases the surface area of a heat-generating component (e.g., a Field Programmable Gate Array - FPGA), allowing air to carry away heat more efficiently. * **Reliability Enhancement:** By lowering the operating temperature, it prevents thermal throttling and extends the Mean Time Between Failures (MTBF) of the semiconductor it covers. * **EMI Shielding (Incidental):** Because it is an aluminum mass, it may provide minor electromagnetic interference shielding for the component directly underneath it. ### 4. Mounting & Compatibility * **Push-Pin Mechanism:** Features a pre-drilled hole requirement on the PCB. The pins are pushed through the holes, and the springs apply consistent pressure (Force) to the component for optimal thermal contact. * **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied thermal tape or grease (like T766) to ensure no air gaps exist between the heat sink and the chip.