The **ATS-10B-20-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Dimensions** | 45mm x 45mm x 10mm (L x W x H) | | **Thermal Resistance** | 7.14 °C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Interface Material** | T766 (Thermal Tape) | | **Airflow Direction** | Horizontal (High-performance Fin Design) | --- ### 2. Key Design Components #### A. The maxiFLOW™ Fin Geometry The "B" in the part number indicates a specific flared fin design. This geometry is engineered to maximize surface area and increase the effectiveness of convective heat transfer. It is particularly effective in systems where airflow is directed across the board. #### B. pushPIN™ Attachment System Instead of simple adhesive, this part uses a **pushPIN™** mechanism. * **Purpose:** Ensures consistent pressure between the heat sink and the component. * **Benefit:** Improves thermal conductivity and provides a secure mechanical fit that resists vibration. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766 phase-change material** or high-performance thermal tape. This fills the microscopic air gaps between the heat sink base and the electronic chip, significantly reducing thermal impedance. --- ### 3. Part Number Breakdown (Nomenclature) To understand the specific electronic configuration, we can decode the SKU: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **10B** | Series: maxiFLOW™ Flared Fin | | **20** | Height: 20 units (specific to ATS scale) | | **C2** | Material/Finish: Aluminum / Blue Anodized | | **R0** | RoHS Compliant / Revision code | --- ### 4. Typical Applications This component is typically found in: * **Telecommunications:** Cooling of high-speed network switches. * **Computing:** Secondary cooling for chipsets or VRMs (Voltage Regulator Modules). * **Industrial Power:** Heat dissipation for power transistors and MOSFETs.