The **ATS-10B-26-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, and other heat-generating ICs. --- ### 1. Technical Specifications Below are the primary mechanical and thermal specifications for this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ | | **Thermal Resistance (Flowing)** | 14.20 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 3.10 °C/W | | **Length (X)** | 70.00 mm | | **Width (Y)** | 70.00 mm | | **Height (Z)** | 10.00 mm | | **Pitch** | 1.27 mm | --- ### 2. Breakdown of the Part Number The part number provides specific details about the configuration and materials: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **10B:** Part series (pushPIN™ Heat Sink System). * **26:** Specific geometric profile/fin configuration. * **C2:** Thermal Interface Material (TIM) and Finish indicator. "C2" typically denotes a **Blue Anodized** finish with a specific pre-applied T766 phase-change material or similar TIM. * **R0:** Revision code / RoHS Compliance status. --- ### 3. Key Features & Components #### A. Fin Design The device features a **High-Performance Fin Pattern**. These are typically "cross-cut" or "straight fin" designs optimized for low-pressure drop and high surface area contact with airflow. #### B. pushPIN™ Attachment Mechanism Unlike adhesive-based heat sinks, this uses a spring-loaded pin system: * **Pressure:** Ensures constant, uniform pressure on the component for maximum thermal transfer. * **Security:** Provides a mechanical lock to the PCB, preventing the heat sink from shifting during vibration or shipping. * **Installation:** Uses standardized hole patterns (e.g., 63.00mm pitch for this model). #### C. Thermal Interface Material (TIM) The base is usually pre-applied with a thermal pad or paste. This fills the microscopic air gaps between the semiconductor die and the aluminum base, significantly reducing thermal impedance. --- ### 4. Implementation Considerations When integrating the ATS-10B-26-C2-R0 into a design, engineers must calculate: 1. **Airflow Direction:** Ensure the fins are aligned with the system's fan exhaust. 2. **Keep-out Zones:** The pushPIN footprint requires specific clearance on the PCB for the springs and plastic/brass pins. 3. **Component Height:** At 10mm tall, it is considered a "Low Profile" heat sink, suitable for 1U servers or slim electronic enclosures.