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  • ATS-10B-30-C2-R0

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    The **ATS-10B-30-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to their "maxiFLOW™" series, designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-10B-30-C2-R0 | | **Material** | Aluminum (High Performance) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 5.31°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 57.90mm x 60.96mm x 25.00mm | | **Compliance** | RoHS Compliant | --- ### Core Electronic & Physical Components #### 1. Heat Sink Body (The Fin Array) The "maxiFLOW™" design features a tapered fin geometry. This design increases the surface area while reducing pressure drop, allowing air to flow more efficiently through the fins. In electronics, this is crucial for preventing **Thermal Throttling**, where a chip slows down its clock speed to avoid melting. #### 2. pushPIN™ Attachment System Unlike cheap adhesive-backed heat sinks, this part uses a **pushPIN™** system. * **Mechanical Stability:** It uses a brass or plastic pin with a compressed spring. * **Constant Pressure:** The spring ensures consistent contact pressure between the heat sink base and the electronic component (die), which is vital for efficient heat transfer. #### 3. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates the specific thermal interface material or revision. This unit usually comes pre-applied with a **Phase Change Material** or high-conductivity grease on the base. This fills the microscopic air gaps between the chip and the aluminum base to lower thermal impedance. --- ### Comparison of Airflow Performance Thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 5.31 | | 400 (2.0 m/s) | 1.90 | | 600 (3.0 m/s) | 1.30 |
    ✨ Follow-up Questions
    • ⤷ What are the advantages of pushPIN attachment over adhesive tape?
    • ⤷ How does the Blue Anodized finish affect thermal performance?
    • ⤷ Can this heat sink be used for custom PCB projects?