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  • ATS-10B-60-C2-R0

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    The **ATS-10B-60-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for cooling high-power semiconductors like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The model number encodes specific physical and performance characteristics: | Property | Specification | Details | | :--- | :--- | :--- | | **Dimensions** | 45mm x 45mm x 25mm | Standard square footprint with a 25mm height. | | **Material** | Aluminum | Lightweight with high thermal conductivity. | | **Finish** | Blue Anodized | Enhances corrosion resistance and emissivity. | | **Attachment** | pushPIN™ | Uses a spring-loaded pin for consistent pressure. | | **Thermal Resistance** | ~1.40 °C/W (@ 200 LFM) | Lower is better for heat dissipation. | | **Airflow Pattern** | Fine-Pitch Straight Fin | Optimized for high-velocity ducted airflow. | --- ### 2. Physical Design Features * **Fin Geometry:** The heat sink utilizes a **straight-fin** design. This is ideal for environments where airflow is directed in a straight line, offering a balance between low pressure drop and high surface area. * **Thermal Interface Material (TIM):** The "C2" suffix indicates that it comes pre-applied with **T766** thermal phase change material. This ensures a low-resistance thermal path between the chip and the aluminum base. * **Push-Pin Mounting:** Unlike adhesive tapes, the push-pin mechanism provides a mechanical lock. The springs ensure "constant pressure" (the "R0" designation), which prevents the heat sink from shifting due to vibration or thermal expansion. --- ### 3. Application Use Cases This part is commonly found in the following electronic systems: 1. **Networking Hardware:** High-speed routers and switches where airflow is controlled by chassis fans. 2. **Industrial PCs:** Cooling processors that run 24/7 in harsh environments. 3. **Power Supplies:** Managing the heat of MOSFETs or voltage regulators. --- ### 4. Selection Criteria (C2 vs. R0) When sourcing this part, engineers look at the suffix codes: * **C2:** High-performance thermal grease (T766). * **R0:** Standard hardware package (Plastic push-pin with stainless steel spring). ---
    ✨ Follow-up Questions
    • ⤷ How does the thermal resistance of this heat sink change with different airflow speeds (LFM)?
    • ⤷ What are the PCB hole requirements for installing the pushPIN™ attachment?
    • ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied T766?