ATS-10B-60-C2-R0
AI

The **ATS-10B-60-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for cooling high-power semiconductors like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
The model number encodes specific physical and performance characteristics:
| Property | Specification | Details |
| :--- | :--- | :--- |
| **Dimensions** | 45mm x 45mm x 25mm | Standard square footprint with a 25mm height. |
| **Material** | Aluminum | Lightweight with high thermal conductivity. |
| **Finish** | Blue Anodized | Enhances corrosion resistance and emissivity. |
| **Attachment** | pushPIN™ | Uses a spring-loaded pin for consistent pressure. |
| **Thermal Resistance** | ~1.40 °C/W (@ 200 LFM) | Lower is better for heat dissipation. |
| **Airflow Pattern** | Fine-Pitch Straight Fin | Optimized for high-velocity ducted airflow. |
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### 2. Physical Design Features
* **Fin Geometry:** The heat sink utilizes a **straight-fin** design. This is ideal for environments where airflow is directed in a straight line, offering a balance between low pressure drop and high surface area.
* **Thermal Interface Material (TIM):** The "C2" suffix indicates that it comes pre-applied with **T766** thermal phase change material. This ensures a low-resistance thermal path between the chip and the aluminum base.
* **Push-Pin Mounting:** Unlike adhesive tapes, the push-pin mechanism provides a mechanical lock. The springs ensure "constant pressure" (the "R0" designation), which prevents the heat sink from shifting due to vibration or thermal expansion.
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### 3. Application Use Cases
This part is commonly found in the following electronic systems:
1. **Networking Hardware:** High-speed routers and switches where airflow is controlled by chassis fans.
2. **Industrial PCs:** Cooling processors that run 24/7 in harsh environments.
3. **Power Supplies:** Managing the heat of MOSFETs or voltage regulators.
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### 4. Selection Criteria (C2 vs. R0)
When sourcing this part, engineers look at the suffix codes:
* **C2:** High-performance thermal grease (T766).
* **R0:** Standard hardware package (Plastic push-pin with stainless steel spring).
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- ⤷
How does the thermal resistance of this heat sink change with different airflow speeds (LFM)?
- ⤷ What are the PCB hole requirements for installing the pushPIN™ attachment?
- ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied T766?