The **ATS-10B-68-C2-R0** is a specific high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a breakdown of its technical specifications and characteristics. --- ### 1. Technical Specifications The model number follows a specific nomenclature used by the manufacturer, **Advanced Thermal Solutions (ATS)**. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ HS | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 15.31°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Fin Pattern** | Fine-pitch Straight Fin | --- ### 2. Key Components & Design Features #### A. The pushPIN™ Attachment Unlike adhesive tapes or simple clips, the "10B" series uses a **pushPIN™** system. This consists of: * **Brass/Plastic Pins:** Used to secure the heatsink to the PCB through pre-drilled holes. * **Compression Springs:** These provide a precise amount of downward pressure (Force), ensuring consistent contact between the heatsink base and the component. #### B. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the part comes with a **pre-applied thermal interface material**. This is a high-conductivity pad or grease applied to the base to eliminate air gaps between the chip and the aluminum. #### C. Fin Geometry The "68" in the part number corresponds to a specific fin configuration. These fins are designed to maximize surface area for heat dissipation while maintaining a low profile (15mm height), making it ideal for tight enclosures. --- ### 3. Electronic Performance Data The cooling efficiency of this part depends heavily on the airflow (Linear Feet per Minute - LFM) within the device: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 15.31 | | 300 (1.5 m/s) | 5.89 | | 500 (2.5 m/s) | 3.91 | | 700 (3.5 m/s) | 3.07 | --- ### 4. Typical Applications This component is commonly found in: * **Networking Hardware:** Switches and routers where high-speed processors generate significant heat. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** To cool MOSFETs or voltage regulators.