The **ATS-10B-72-C3-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their "maxiFLOW™" series of high-performance heat sinks. Below is the technical breakdown of its electronic and mechanical specifications. --- ### 1. General Specifications This part is a high-performance heat sink designed for cooling electronic components such as CPUs, GPUs, or high-power ASICs. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-10B-72-C3-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 5.10°C/W (Unducted @ 200 LFM) | --- ### 2. Physical Dimensions Precision measurements are critical for PCB layout and ensuring the part does not interfere with nearby capacitors or connectors. | Dimension | Value | | :--- | :--- | | **Width (A)** | 45.00 mm | | **Length (B)** | 45.00 mm | | **Height (C)** | 15.00 mm | | **Pitch (E)** | 38.00 mm | | **Pitch (F)** | 38.00 mm | --- ### 3. Key Electronic Cooling Characteristics The "C3" and "R0" suffixes in the part number provide specific information regarding the thermal interface and material compliance. * **Thermal Interface Material (TIM):** This model typically comes with **T412** pre-applied. This is a high-efficiency phase-change material that fills microscopic air gaps between the component (chip) and the heat sink. * **pushPIN™ Attachment:** The "10B" designation refers to the attachment mechanism. It uses a brass pin with a stainless steel spring to provide a specific "clamping force" (pressure) onto the electronic chip, ensuring optimal heat transfer without cracking the silicon. * **Fin Design:** It features a "straight-fin" or "cross-cut" design optimized for **impingement** or **ducted** airflow, which is common in server racks or high-density enclosures. --- ### 4. Thermal Performance Table Airflow (measured in Linear Feet per Minute - LFM) significantly impacts the cooling efficiency: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 5.10 | | 400 (2.0 m/s) | 2.50 | | 600 (3.0 m/s) | 1.80 | | 800 (4.0 m/s) | 1.50 | --- ### Summary of Nomenclature * **ATS:** Advanced Thermal Solutions (Brand). * **10B:** pushPIN™ attachment style. * **72:** Specific dimension/geometry code. * **C3:** Specific thermal interface material and performance grade. * **R0:** RoHS compliant (Lead-free).