The **ATS-10B-75-C1-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for cooling electronic components such as BGA (Ball Grid Array) chips, CPUs, or GPUs. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-10B-75-C1-R0 | | **Heat Sink Type** | pushPIN™ Heat Sink Assembly | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.47 °C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Spring Loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the physical and thermal properties: * **ATS-10B**: Refers to the product series and base configuration. * **75**: Denotes the specific fin pattern or spacing configuration. * **C1**: Indicates the thermal interface material (TIM) type or specific mounting hardware configuration. * **R0**: Refers to the revision code or specific packaging/finish style. --- ### 3. Key Electronic/Mechanical Features #### A. Thermal Management This part is designed to dissipate heat from surface-mount devices. Its **cross-cut fin design** allows for multi-directional airflow, making it highly efficient in crowded PCB environments where airflow direction may vary. #### B. pushPIN™ Attachment Unlike adhesive tapes or simple clips, the `pushPIN™` system used here ensures: 1. **Consistent Pressure:** Provides a specific amount of force (determined by the spring) to maximize contact with the chip. 2. **Reliability:** Resistant to vibration and shock compared to thermal tape. 3. **Ease of Assembly:** Features pre-drilled holes for quick installation into PCB mounting holes. #### C. Thermal Interface Material (TIM) The "C1" variant typically comes with a pre-applied high-performance thermal pad or grease, ensuring low thermal resistance between the component and the heat sink base without requiring manual application. --- ### 4. Applications * **Networking Gear:** Routers, switches, and high-speed modems. * **Computing:** Embedded systems, industrial PCs, and server motherboards. * **Power Electronics:** Cooling MOSFETs or power regulators.