The **ATS-10B-76-C3-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components such as CPUs, GPUs, and high-power integrated circuits. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Thermal Resistance** | 11.84°C/W (Unducted Flow @ 100 LFM) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Dimensions** | 25mm x 25mm x 15mm | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Breakdown of the Part Number The alphanumeric code provides specific details about the component's construction: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **10B**: Designates the specific series/physical profile. * **76**: Specific model size and fin density indicator. * **C3**: Indicates the fin pattern and height (specifically "Straight Fin" design). * **R0**: Revision or RoHS compliance status. --- ### 3. Key Electronic Cooling Features #### A. High-Performance Fin Design This heatsink uses a **straight-fin** geometry. This design is optimized for environments with consistent airflow (forced convection), allowing air to pass through the channels easily while maximizing surface area for heat dissipation. #### B. Attachment Mechanism The "Push-Pin" system (with a brass or plastic pin and a compression spring) ensures: 1. **Reliable Pressure**: Constant downward force on the chip to ensure optimal contact. 2. **Ease of Assembly**: Can be installed into pre-drilled holes on a PCB without specialized tools. 3. **Vibration Resistance**: The spring absorbs mechanical shocks that might otherwise dislodge the heatsink. #### C. Thermal Interface Material (TIM) The unit comes with **T412** pre-applied to the base. T412 is a high-performance thermal pad that fills microscopic air gaps between the electronic component and the aluminum base, significantly reducing thermal impedance. --- ### 4. Ideal Applications * **Networking Hardware**: Switches, routers, and modems. * **Embedded Systems**: Industrial PCs and IoT gateways. * **Consumer Electronics**: Set-top boxes and small form factor power supplies. ---