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  • ATS-10B-88-C2-R0

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    The **ATS-10B-88-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for cooling integrated circuits (ICs) such as CPUs, GPUs, and other power-intensive semiconductors. ### 1. Technical Specifications The following table highlights the critical mechanical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (LxWxH)** | 35.00 mm x 35.00 mm x 25.00 mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 10.11 °C/W (Unducted Flow @ 1.0 m/s) | | **Mounting Pattern** | 40.00 mm x 40.00 mm | --- ### 2. Component Breakdown #### A. Thermal Performance The primary function of this part is to dissipate heat from electronic components into the surrounding air. * **Low Airflow:** At low speeds (1.0 m/s), it has a resistance of **10.11 °C/W**. * **High Airflow:** At high speeds (3.5 m/s), the resistance drops significantly to **2.47 °C/W**, making it highly efficient for forced-air cooling environments. #### B. The pushPIN™ Mounting System The "-R0" suffix indicates a specific mounting kit. This system uses a flexible, spring-loaded mechanism that: 1. **Ensures Constant Pressure:** Provides consistent contact between the heat sink and the chip to maximize thermal transfer. 2. **Ease of Assembly:** Features pre-drilled holes and plastic/brass pins for tool-free or low-tool installation on the PCB. #### C. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just aesthetic; the anodized layer provides corrosion resistance and increases surface emissivity, slightly improving radiation heat transfer. --- ### 3. Part Number Nomenclature Understanding the code `ATS-10B-88-C2-R0`: * **ATS**: Advanced Thermal Solutions (Manufacturer). * **10B**: Product Series (pushPIN™ Heat Sink). * **88**: Specific fin geometry/pattern. * **C2**: Material/Finish code (typically Aluminum/Blue Anodized). * **R0**: Versioning and specific mounting hardware package. ---
    ✨ Follow-up Questions
    • ⤷ What is the compatible PCB hole size for the pushPIN mounting system?
    • ⤷ Does this heat sink come with pre-applied Thermal Interface Material (TIM)?
    • ⤷ How does the fin height of 25mm affect its cooling efficiency compared to shorter models?