ATS-10B-88-C2-R0
AI

The **ATS-10B-88-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for cooling integrated circuits (ICs) such as CPUs, GPUs, and other power-intensive semiconductors.
### 1. Technical Specifications
The following table highlights the critical mechanical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions (LxWxH)** | 35.00 mm x 35.00 mm x 25.00 mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | 10.11 °C/W (Unducted Flow @ 1.0 m/s) |
| **Mounting Pattern** | 40.00 mm x 40.00 mm |
---
### 2. Component Breakdown
#### A. Thermal Performance
The primary function of this part is to dissipate heat from electronic components into the surrounding air.
* **Low Airflow:** At low speeds (1.0 m/s), it has a resistance of **10.11 °C/W**.
* **High Airflow:** At high speeds (3.5 m/s), the resistance drops significantly to **2.47 °C/W**, making it highly efficient for forced-air cooling environments.
#### B. The pushPIN™ Mounting System
The "-R0" suffix indicates a specific mounting kit. This system uses a flexible, spring-loaded mechanism that:
1. **Ensures Constant Pressure:** Provides consistent contact between the heat sink and the chip to maximize thermal transfer.
2. **Ease of Assembly:** Features pre-drilled holes and plastic/brass pins for tool-free or low-tool installation on the PCB.
#### C. Material and Coating
* **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties.
* **Blue Anodizing:** This is not just aesthetic; the anodized layer provides corrosion resistance and increases surface emissivity, slightly improving radiation heat transfer.
---
### 3. Part Number Nomenclature
Understanding the code `ATS-10B-88-C2-R0`:
* **ATS**: Advanced Thermal Solutions (Manufacturer).
* **10B**: Product Series (pushPIN™ Heat Sink).
* **88**: Specific fin geometry/pattern.
* **C2**: Material/Finish code (typically Aluminum/Blue Anodized).
* **R0**: Versioning and specific mounting hardware package.
---
- ⤷
What is the compatible PCB hole size for the pushPIN mounting system?
- ⤷ Does this heat sink come with pre-applied Thermal Interface Material (TIM)?
- ⤷ How does the fin height of 25mm affect its cooling efficiency compared to shorter models?