The **ATS-10B-91-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Dimensions** | 40mm x 40mm | | **Height** | 10.00 mm | | **Attachment Type** | Push-Pin (Plastic) | | **Thermal Resistance** | 6.27 °C/W (at 100 LFM) | | **Fin Style** | Straight Fin | | **TIM (Thermal Interface Material)** | T412 (Phase Change Material) | --- ## 2. Key Components & Design Features ### A. Fin Geometry (Straight Fin) The "Straight Fin" design is optimized for **forced air convection**. These fins allow air to flow through the channels with minimal pressure drop, making them highly effective when paired with a nearby cooling fan. ### B. Push-Pin Attachment Mechanism Instead of using adhesive tapes which can degrade over time, this part uses a **plastic push-pin with a built-in spring**. * **Security:** Provides constant pressure (load) on the component to ensure maximum contact. * **Installation:** Requires pre-drilled holes in the PCB. ### C. Thermal Interface Material (TIM) The part comes pre-applied with **T412**. This is a high-performance thermal pad that softens at operating temperatures to fill microscopic air gaps between the heat sink and the chip, significantly improving heat transfer efficiency. --- ## 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **10B** | Series/Attachment Style (Push-Pin) | | **91** | Product Dimensions/Geometry Code | | **C3** | Thermal Performance/Material Grade | | **R0** | Revision/Packaging Code | --- ## 4. Usage Considerations * **Airflow Direction:** Ensure the heat sink is oriented so that the fins align with the system's airflow. * **PCB Holes:** You must verify that your PCB layout includes the specific hole pattern required for the push-pins. * **Component Height:** At only 10mm high, this is a **low-profile** solution, making it ideal for 1U servers or compact embedded systems.