The **ATS-10D-03-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors and PCBs. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-10D-03-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 40mm x 40mm x 15mm | | **Thermal Resistance** | 15.83°C/W (at 100 LFM) | | **Weight** | 13 grams | --- ## 2. Core Components & Design Features ### A. Material & Surface Treatment The part is fabricated from **Aluminum 6063**, known for high thermal conductivity and structural integrity. The **Blue Anodized** finish is not just aesthetic; it provides: * Increased corrosion resistance. * Improved surface emissivity (enhanced heat radiation). * Electrical insulation of the heat sink surface. ### B. pushPIN™ Attachment System This component uses a specialized mounting system rather than simple adhesive: * **Push Pins:** Made of nylon or brass, these provide secure attachment through pre-drilled PCB holes. * **Compression Springs:** These ensure constant, high-pressure contact between the heat sink and the electronic component (CPU, FPGA, etc.), maximizing thermal transfer. ### C. Fin Geometry The "D" in the part number often signifies a specific fin pattern (Cross-Cut or Straight). In this model, the design is optimized for: * **High Airflow:** Minimizing pressure drop. * **Surface Area:** Maximizing the "wetted" area exposed to moving air to dissipate heat faster. --- ## 3. Thermal Performance Metrics The effectiveness of the ATS-10D-03-C2-R0 depends on the airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 15.83 | | 200 | 1.0 | 5.76 | | 400 | 2.0 | 3.05 | | 600 | 3.0 | 2.19 | --- ## 4. Common Applications This heat sink is typically used on high-heat electronic components such as: * **BGA Packages:** Ball Grid Array chips. * **ASICs / FPGAs:** High-speed processing units in networking hardware. * **Power Transistors:** Components that regulate high voltages. ---