### Technical Overview of ATS-10D-100-C2-R0 The **ATS-10D-100-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the **pushPIN™** series, designed to provide efficient thermal management for electronic components like CPUs, GPUs, and power transistors. --- ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Product Series** | pushPIN™ Heat Sink | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance (Flowing)** | 18.59 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 4.45 °C/W | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Fin Style** | Straight Fin | --- ### 2. Core Electronic/Thermal Components The effectiveness of this part relies on several physical and material characteristics: * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766**, a high-performance thermal grease. This ensures low thermal resistance between the electronic component (heat source) and the heat sink base. * **Fin Design:** It utilizes a straight-fin pattern. This is optimized for specific airflow directions, allowing heat to dissipate rapidly into the surrounding air as it is moved by a fan or natural convection. * **The pushPIN™ Mechanism:** Unlike adhesive tapes, this uses a spring-loaded push-pin system. This provides **consistent pressure** across the electronic package, which is critical for maintaining thermal contact and preventing damage from vibration. --- ### 3. Application in Circuitry This part is primarily used to prevent **Thermal Throttling** or hardware failure in high-density electronic environments. 1. **Heat Dissipation:** It absorbs heat from the semiconductor junction through conduction. 2. **Mounting Compatibility:** The push-pin holes are designed for standard PCB layouts, making it easy to integrate into motherboards or industrial control units. 3. **Efficiency:** The "C2" in the part number indicates it is made from aluminum, which provides a balance between lightweight design and thermal conductivity. --- ### 4. Thermal Performance Data | Air Velocity (LFM) | 100 (0.5m/s) | 300 (1.5m/s) | 500 (2.5m/s) | | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 18.59 | 7.95 | 5.23 | ---