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  • ATS-10D-151-C1-R0

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    The **ATS-10D-151-C1-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "blue ice" or high-efficiency push-pin series. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-10D-151-C1-R0 | | **Type** | Board Level, Push-Pin Mount | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 35.00mm x 35.00mm | | **Height (Off Base)** | 10.00mm | | **Fin Style** | Straight (Standard) | | **Thermal Resistance** | 19.30°C/W (at 100 LFM) | | **Attachment Method** | Brass Push-Pin (with Compression Spring) | --- ### Key Electronic & Physical Components #### 1. Heat Sink Body (The Conductor) The main body is made of high-grade aluminum. It is designed with vertical fins that increase the surface area available for heat dissipation. In electronics, this is critical for preventing **thermal throttling** or component failure in power-dense chips. #### 2. Push-Pin Mounting Mechanism Unlike adhesive-based heat sinks, this model uses a mechanical mounting system: * **Brass Pins:** These fit through pre-drilled holes in the PCB. * **Compression Springs:** These ensure a consistent, high-pressure contact between the heat sink and the electronic component (CPU, GPU, or MOSFET). This constant pressure is vital for maximizing heat transfer efficiency. #### 3. Thermal Interface Material (TIM) The "R0" designation usually indicates that a **Thermal Interface Material** (pre-applied phase-change material or thermal pad) is included on the base. This fills the microscopic air gaps between the component and the metal, significantly lowering the thermal resistance. --- ### Applications This part is commonly used in the following electronic environments: * **Telecommunications:** For cooling high-speed networking chips. * **Embedded Systems:** Industrial PCs where space is limited but heat output is high. * **Power Electronics:** Cooling voltage regulators or small power modules. ---
    ✨ Follow-up Questions
    • ⤷ What are the advantages of push-pin mounting versus thermal adhesive?
    • ⤷ How does the LFM (Linear Feet per Minute) affect the thermal resistance of this part?
    • ⤷ What is the recommended hole size on the PCB for this specific push-pin model?