ATS-10D-151-C1-R0
AI

The **ATS-10D-151-C1-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "blue ice" or high-efficiency push-pin series.
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### Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Part Number** | ATS-10D-151-C1-R0 |
| **Type** | Board Level, Push-Pin Mount |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W)** | 35.00mm x 35.00mm |
| **Height (Off Base)** | 10.00mm |
| **Fin Style** | Straight (Standard) |
| **Thermal Resistance** | 19.30°C/W (at 100 LFM) |
| **Attachment Method** | Brass Push-Pin (with Compression Spring) |
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### Key Electronic & Physical Components
#### 1. Heat Sink Body (The Conductor)
The main body is made of high-grade aluminum. It is designed with vertical fins that increase the surface area available for heat dissipation. In electronics, this is critical for preventing **thermal throttling** or component failure in power-dense chips.
#### 2. Push-Pin Mounting Mechanism
Unlike adhesive-based heat sinks, this model uses a mechanical mounting system:
* **Brass Pins:** These fit through pre-drilled holes in the PCB.
* **Compression Springs:** These ensure a consistent, high-pressure contact between the heat sink and the electronic component (CPU, GPU, or MOSFET). This constant pressure is vital for maximizing heat transfer efficiency.
#### 3. Thermal Interface Material (TIM)
The "R0" designation usually indicates that a **Thermal Interface Material** (pre-applied phase-change material or thermal pad) is included on the base. This fills the microscopic air gaps between the component and the metal, significantly lowering the thermal resistance.
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### Applications
This part is commonly used in the following electronic environments:
* **Telecommunications:** For cooling high-speed networking chips.
* **Embedded Systems:** Industrial PCs where space is limited but heat output is high.
* **Power Electronics:** Cooling voltage regulators or small power modules.
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- ⤷
What are the advantages of push-pin mounting versus thermal adhesive?
- ⤷ How does the LFM (Linear Feet per Minute) affect the thermal resistance of this part?
- ⤷ What is the recommended hole size on the PCB for this specific push-pin model?