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  • ATS-10D-16-C2-R0

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    The **ATS-10D-16-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling electronic integrated circuits (ICs). --- ### 1. Technical Specifications The model name is alphanumeric, where each segment represents a specific physical characteristic: | Feature | Specification | Description | | :--- | :--- | :--- | | **Series** | pushPIN™ | Uses a flexible attachment mechanism with springs. | | **Material** | Aluminum | Lightweight with high thermal conductivity. | | **Finish** | Blue Anodized | Increases surface emissivity and prevents corrosion. | | **Base Dimension** | 35mm x 35mm | The footprint of the heat sink on the chip. | | **Height** | 25mm | Vertical clearance required for the component. | | **Attachment** | Push-Pin | Secure mounting using holes in the PCB. | | **Thermal Interface** | T766 | Pre-applied phase change material/grease. | --- ### 2. Physical Design and Construction The ATS-10D-16-C2-R0 utilizes a **High-Performance Cross-Cut** pattern. * **Fins:** It features a matrix of square or rectangular pins (fins). This design increases the surface area for heat dissipation while allowing airflow from multiple directions (omnidirectional). * **Base:** A flat, polished aluminum base ensures maximum contact with the electronic component (CPU, GPU, or FPGA). * **Push-Pin Mechanism:** It uses a brass or plastic pin with a high-tension spring. This provides constant pressure (7-10 PSI) to the thermal interface material, ensuring optimal heat transfer. --- ### 3. Thermal Performance Data The efficiency of this part is measured by its thermal resistance ($^\circ\text{C/W}$). A lower number indicates better cooling. * **Unducted Flow:** ~4.95 $^\circ\text{C/W}$ @ 100 LFM (Linear Feet per Minute). * **Ducted Flow:** ~1.45 $^\circ\text{C/W}$ @ 100 LFM. * **Application:** Ideal for medium-to-high heat density components where forced air (fans) is present within the chassis. --- ### 4. Implementation Checklist ```json { "part_number": "ATS-10D-16-C2-R0", "mounting_hole_pitch": "40.00mm", "pin_material": "Brass", "spring_type": "Stainless Steel", "thermal_material": "T766 (Pre-Applied)" } ``` ---
    ✨ Follow-up Questions
    • ⤷ What are the differences between blue anodized and black anodized heat sinks?
    • ⤷ How do I calculate the required LFM for my specific electronic component?
    • ⤷ What is the benefit of the T766 thermal interface material compared to standard grease?