ATS-10D-16-C2-R0
AI

The **ATS-10D-16-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling electronic integrated circuits (ICs).
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### 1. Technical Specifications
The model name is alphanumeric, where each segment represents a specific physical characteristic:
| Feature | Specification | Description |
| :--- | :--- | :--- |
| **Series** | pushPIN™ | Uses a flexible attachment mechanism with springs. |
| **Material** | Aluminum | Lightweight with high thermal conductivity. |
| **Finish** | Blue Anodized | Increases surface emissivity and prevents corrosion. |
| **Base Dimension** | 35mm x 35mm | The footprint of the heat sink on the chip. |
| **Height** | 25mm | Vertical clearance required for the component. |
| **Attachment** | Push-Pin | Secure mounting using holes in the PCB. |
| **Thermal Interface** | T766 | Pre-applied phase change material/grease. |
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### 2. Physical Design and Construction
The ATS-10D-16-C2-R0 utilizes a **High-Performance Cross-Cut** pattern.
* **Fins:** It features a matrix of square or rectangular pins (fins). This design increases the surface area for heat dissipation while allowing airflow from multiple directions (omnidirectional).
* **Base:** A flat, polished aluminum base ensures maximum contact with the electronic component (CPU, GPU, or FPGA).
* **Push-Pin Mechanism:** It uses a brass or plastic pin with a high-tension spring. This provides constant pressure (7-10 PSI) to the thermal interface material, ensuring optimal heat transfer.
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### 3. Thermal Performance Data
The efficiency of this part is measured by its thermal resistance ($^\circ\text{C/W}$). A lower number indicates better cooling.
* **Unducted Flow:** ~4.95 $^\circ\text{C/W}$ @ 100 LFM (Linear Feet per Minute).
* **Ducted Flow:** ~1.45 $^\circ\text{C/W}$ @ 100 LFM.
* **Application:** Ideal for medium-to-high heat density components where forced air (fans) is present within the chassis.
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### 4. Implementation Checklist
```json
{
"part_number": "ATS-10D-16-C2-R0",
"mounting_hole_pitch": "40.00mm",
"pin_material": "Brass",
"spring_type": "Stainless Steel",
"thermal_material": "T766 (Pre-Applied)"
}
```
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- ⤷
What are the differences between blue anodized and black anodized heat sinks?
- ⤷ How do I calculate the required LFM for my specific electronic component?
- ⤷ What is the benefit of the T766 thermal interface material compared to standard grease?