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  • ATS-10D-166-C3-R0

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    The **ATS-10D-166-C3-R0** is a high-performance electronic component specifically categorized as a **Heat Sink** assembly. It is manufactured by Advanced Thermal Solutions (ATS) and is part of their "pushPIN™" thermal management line. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part: | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W)** | 25mm x 25mm | | **Height (Height Off Base)** | 15mm | | **Thermal Resistance (Unducted)** | 12.30 °C/W @ 100 LFM | --- ### 2. Physical Design and Construction The design of the ATS-10D-166-C3-R0 is optimized for small-form-factor electronics that generate significant heat. * **Fin Style:** It features a **Straight Fin** design. This is ideal for applications where airflow is consistent and follows a single direction. * **Base Material:** Made of aluminum, which provides a balance between high thermal conductivity and low weight. * **Thermal Interface Material (TIM):** This specific model typically comes with **T412** TIM pre-applied to the base, ensuring efficient heat transfer from the component (CPU, GPU, or MOSFET) to the sink. --- ### 3. Attachment Mechanism: pushPIN™ The "10D" and "C3" segments of the part number refer to the specific mounting hardware used: * **Push Pins:** Uses nylon or brass pins that snap into pre-drilled holes on the PCB. * **Compression Springs:** Provides consistent pressure (clamping force) across the interface, which prevents the heat sink from shifting and ensures the TIM remains effective. * **Ease of Assembly:** Designed for quick installation without the need for specialized tools. --- ### 4. Application Use Cases This heat sink is commonly found in: 1. **Telecommunications:** Cooling small processors in routers or switches. 2. **Embedded Systems:** Industrial PCs where space is limited. 3. **Power Electronics:** Cooling voltage regulators or small motor drivers. ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between ducted and unducted thermal resistance for this part?
    • ⤷ Can this heat sink be customized with different spring tensions?
    • ⤷ How do I calculate if 12.30 °C/W is sufficient for my specific chip?