ATS-10D-166-C3-R0
AI

The **ATS-10D-166-C3-R0** is a high-performance electronic component specifically categorized as a **Heat Sink** assembly. It is manufactured by Advanced Thermal Solutions (ATS) and is part of their "pushPIN™" thermal management line.
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### 1. Technical Specifications
Below are the primary technical parameters for this specific part:
| Parameter | Specification |
|:---|:---|
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Dimensions (L x W)** | 25mm x 25mm |
| **Height (Height Off Base)** | 15mm |
| **Thermal Resistance (Unducted)** | 12.30 °C/W @ 100 LFM |
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### 2. Physical Design and Construction
The design of the ATS-10D-166-C3-R0 is optimized for small-form-factor electronics that generate significant heat.
* **Fin Style:** It features a **Straight Fin** design. This is ideal for applications where airflow is consistent and follows a single direction.
* **Base Material:** Made of aluminum, which provides a balance between high thermal conductivity and low weight.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T412** TIM pre-applied to the base, ensuring efficient heat transfer from the component (CPU, GPU, or MOSFET) to the sink.
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### 3. Attachment Mechanism: pushPIN™
The "10D" and "C3" segments of the part number refer to the specific mounting hardware used:
* **Push Pins:** Uses nylon or brass pins that snap into pre-drilled holes on the PCB.
* **Compression Springs:** Provides consistent pressure (clamping force) across the interface, which prevents the heat sink from shifting and ensures the TIM remains effective.
* **Ease of Assembly:** Designed for quick installation without the need for specialized tools.
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### 4. Application Use Cases
This heat sink is commonly found in:
1. **Telecommunications:** Cooling small processors in routers or switches.
2. **Embedded Systems:** Industrial PCs where space is limited.
3. **Power Electronics:** Cooling voltage regulators or small motor drivers.
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- ⤷
What is the difference between ducted and unducted thermal resistance for this part?
- ⤷ Can this heat sink be customized with different spring tensions?
- ⤷ How do I calculate if 12.30 °C/W is sufficient for my specific chip?