The **ATS-10D-174-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for thermal management in electronic components, specifically for BGAs (Ball Grid Arrays). --- ## 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 30.00mm x 30.00mm x 10.00mm | | **Attachment Method** | Push Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 13.92°C/W (at 200 LFM) | | **Airflow Path** | Fine-Pitch (Vertical fins) | --- ## 2. Key Design Elements ### A. Fin Geometry This heat sink features a **straight-fin design**. This is ideal for forced-air cooling systems where air moves in a specific direction across the fins. The low profile (10mm) makes it suitable for tight enclosures where vertical space is limited. ### B. Attachment Mechanism The "C2" in the part number indicates the specific push-pin and spring combination: * **Push Pins:** Provide high-retention force and ease of installation on the PCB. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766** phase-change material to ensure low thermal resistance between the heat sink and the chip. ### C. Material & Efficiency * **Aluminum (6063):** Offers a high thermal conductivity-to-weight ratio. * **Blue Anodized Coating:** Enhances durability, provides minor electrical insulation, and increases thermal emissivity. --- ## 3. Applications The ATS-10D-174-C2-R0 is commonly found in the following electronic environments: 1. **Networking Hardware:** Switches and routers where high-density components generate significant heat. 2. **Embedded Systems:** Microcontrollers and FPGA units. 3. **Industrial PCs:** Cooling processors in environments with constant airflow.