The **ATS-10D-175-C2-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Thermal Resistance** | 13.52°C/W (undirected flow) | | **Flow Pattern** | Omni-directional (Pin Fin) | --- ### 2. Key Electronic Features #### A. pushPIN™ Attachment System This part uses a specialized mechanical attachment system. Instead of using messy adhesives or thermal tape, it utilizes: * **Brass Springs:** Ensures consistent pressure (clamping force) against the electronic component for optimal heat transfer. * **Plastic Push-Pins:** Allows for secure mounting to pre-drilled holes in the PCB. #### B. Thermal Interface Material (TIM) The "R0" suffix indicates that the heat sink comes pre-applied with **ATS-CPT-1049**, a high-performance Phase Change Material or Thermal Grease. This eliminates the need for manual application and ensures there are no air gaps between the component and the heat sink. #### C. Omni-directional Cooling Unlike "straight fin" heat sinks that require airflow to come from a specific direction, the **Pin Fin** design allows air to enter from any angle. This is critical in cramped electronic enclosures where airflow patterns are unpredictable. --- ### 3. Applications This component is typically used in the following electronic sectors: * **Telecommunications:** Cooling for high-speed networking chips. * **Industrial PCs:** Compact motherboards where vertical space (10mm height) is limited. * **Embedded Systems:** High-power SoC (System on Chip) modules. ---