ATS-10D-183-C2-R0
AI

The **ATS-10D-183-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing cooling solutions to PCBs.
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### 1. Technical Specifications
The following table highlights the core mechanical and thermal properties of this component:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | Push-Pin (Plastic) |
| **Heat Sink Type** | XCUT (Cross-cut) |
| **Thermal Resistance** | 5.37°C/W (at 200 LFM) |
| **Base Dimensions** | 40.00mm x 40.00mm |
| **Height** | 20.00mm |
| **Thermal Interface (TIM)** | T766 (Pre-applied) |
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### 2. Design Features
* **XCUT Fin Geometry:** The "XCUT" design features a cross-cut pattern. This allows for multi-directional airflow, making it ideal for systems where the direction of the fan exhaust might vary or be restricted.
* **Push-Pin Attachment:** Instead of adhesive tape or heavy hardware, it uses a spring-loaded push-pin mechanism. This provides consistent pressure (load) on the high-power component, ensuring better heat transfer.
* **Material Efficiency:** Made from extruded aluminum, which offers a balance between lightweight design and effective thermal conductivity.
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### 3. Electronic Application
This specific heat sink is typically used to cool high-heat-generating integrated circuits (ICs) including:
* **Processors (CPUs/GPUs):** For low-power embedded systems.
* **FPGAs & ASICs:** Used in telecommunications and data processing.
* **Power Modules:** Voltage regulators or motor drivers that require passive or active cooling to prevent thermal throttling or hardware failure.
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### 4. Part Number Breakdown
The nomenclature for ATS heat sinks generally follows this logic:
| Segment | Meaning |
| :--- | :--- |
| **ATS-10D** | Series/Push-pin style |
| **183** | Specific Die/Fin configuration |
| **C2** | Color/Finish (Blue Anodized) |
| **R0** | Revision or packaging code |
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What are the alternative attachment methods for heat sinks besides push-pins?
- ⤷ How does 'LFM' (Linear Feet per Minute) affect the thermal resistance of this part?
- ⤷ Can the T766 thermal interface material be replaced with standard thermal paste?