The **ATS-10D-184-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for secure and efficient cooling of integrated circuits (ICs) and other PCB components. --- ## 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-10D-184-C2-R0 | | **Type** | Top Mount / Push-Pin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 4.14 °C/W (at 100 LFM) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 25mm | --- ## 2. Key Features and Electronic Design ### A. Fin Design The "184" in the part number refers to a specific fin pattern. This model typically utilizes a **Cross-cut fin design**, which allows for omnidirectional airflow. This is critical in dense electronic enclosures where the direction of the cooling fan's exhaust might not be perfectly aligned with the heat sink. ### B. Material and Thermal Interface * **Aluminum Construction:** Provides a lightweight solution with high thermal conductivity. * **Thermal Interface Material (TIM):** This specific part number comes pre-applied with **T766**, a high-performance thermal phase-change material that ensures minimal air gaps between the component (CPU/GPU/ASIC) and the heat sink. ### C. Mechanical Attachment (Push-Pin) Unlike adhesive-based heat sinks, the push-pin system uses a **compression spring** and a brass pin. * **Reliability:** It provides consistent pressure across the chip surface. * **Reusability:** It can be removed and reinstalled without damaging the PCB, provided the board has the required mounting holes (3.0mm diameter). --- ## 3. Performance Analysis (Thermal Resistance) Thermal resistance indicates how effectively the part moves heat away from the silicon. Lower numbers are better. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 4.14 | | 300 (1.5 m/s) | 2.26 | | 500 (2.5 m/s) | 1.83 | | 700 (3.5 m/s) | 1.63 | --- ## 4. Typical Applications * **Network Switches/Routers:** Cooling high-speed processing chips. * **Industrial PCs:** Maintaining stability in high-temperature environments. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.