The **ATS-10D-19-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **maxiFLOW™** product line, designed for cooling high-power semiconductors and integrated circuits. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Extruded) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 9.77°C/W @ 100 LFM (Linear Feet per Minute) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 20.00mm | | **Fin Type** | Straight Fin | | **RoHS Status** | Compliant | --- ### 2. Design Characteristics #### A. Fin Geometry (maxiFLOW™) The "maxiFLOW" design features a high-aspect-ratio fin structure. This increases the surface area for heat dissipation while maintaining low pressure drop, making it highly effective in forced-air environments (using fans). #### B. Attachment System: pushPIN™ This part utilizes the **pushPIN™** mounting system. It consists of a spring-loaded pin that passes through pre-drilled holes in the PCB. This provides: * **Constant Pressure:** Ensures optimal contact between the heat sink and the component (like a CPU or FPGA). * **Vibration Resistance:** Suitable for industrial or automotive environments where movement is a factor. #### C. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodization:** This is not just for aesthetics; the anodized layer provides electrical insulation and improves the "emissivity" of the surface, allowing for slightly better radiant heat transfer. --- ### 3. Part Number Breakdown (Nomenclature) The part number follows a specific logic: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **10D** | Series or internal design revision | | **19** | Specific size/geometry identifier | | **C2** | Thermal performance/Fin configuration class | | **R0** | Revision or Packaging code | --- ### 4. Application Use Cases This heat sink is typically found in: 1. **Telecommunications:** Cooling network switches and routers. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Dissipating heat from Voltage Regulators or Power Modules.