The **ATS-10D-20-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" heat sink series, designed primarily for high-performance cooling of semiconductors like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Type** | Heat Sink | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm | | **Thermal Resistance** | 3.33°C/W (@ 200 LFM) | | **Flow Pattern** | maxiFLOW™ (Flared Fin) | --- ### 2. Breakdown of Part Number The part number follows a specific nomenclature used by ATS to identify the product's attributes: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **10D**: Series designation (typically refers to the pushPIN attachment style). * **20**: Height indicator (approximately 25mm including base). * **C2**: Material and Finish (Aluminum with a **Black Anodized** finish). * **R0**: Revision/Packaging code. --- ### 3. Key Electronic/Thermal Features #### A. Flared Fin Design (maxiFLOW™) Unlike standard straight-fin heat sinks, the flared fin geometry increases the surface area available for heat dissipation while maintaining a low pressure drop. This is critical in electronics where airflow might be limited or restricted by other components. #### B. pushPIN™ Attachment The part utilizes a spring-loaded mechanism that ensures: 1. **Uniform Pressure:** Prevents mechanical stress on the delicate silicon die. 2. **Reliability:** Maintains a consistent thermal interface even during vibration or thermal expansion. 3. **Ease of Assembly:** Can be installed via pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The "R0" variant typically comes with a pre-applied **Phase Change Material (PCM)** or high-performance thermal pad on the base. This ensures that air gaps between the heat sink and the electronic chip are eliminated for maximum heat transfer. --- ### 4. Applications This part is commonly used in industrial and telecommunications hardware, including: * **Embedded Systems:** For cooling high-speed processors. * **Network Switches:** Handling heat from ASICs. * **Power Supplies:** Cooling MOSFETs or power modules.