The **ATS-10D-202-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. These parts are designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or FPGAs, within electronic assemblies. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal properties: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Push-Pin (Vertical Fin) | | **Material** | Aluminum (Anodized Blue) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Thermal Resistance** | ~14.80°C/W (at 200 LFM) | | **Attachment Method** | Plastic Push-Pin with Brass Spring | | **Interface Material** | T766 (Thermal Tape/Phase Change) | --- ### 2. Key Electronic & Mechanical Components #### A. Fin Geometry (The Heat Sink) This part utilizes a **straight-fin** design. In electronics, the fins increase the surface area available for heat transfer to the ambient air. The 15mm height makes it suitable for "low-profile" or "1U" server rack applications where vertical space is limited. #### B. Attachment Mechanism (Push-Pins & Springs) Instead of using adhesive tape alone, which can degrade over time, this part uses **plastic push-pins** and **compression springs**. * **Purpose:** To provide consistent "downward pressure" (Clip Force) onto the electronic chip. * **Reliability:** Ensures that the thermal interface material (TIM) remains in contact with the die even under vibration or thermal expansion. #### C. Thermal Interface Material (TIM) The "C2" suffix typically refers to the **T766** thermal interface. This is a pre-applied layer on the base of the heat sink. * **Function:** It fills microscopic air gaps between the component (CPU/FPGA) and the aluminum heat sink, significantly reducing thermal resistance. --- ### 3. Application Use Cases This specific part is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling signal processing chips in routers and switches. 2. **Embedded Systems:** Industrial PCs where mechanical shocks require a secure push-pin mount. 3. **Power Supplies:** Dissipating heat from high-speed switching transistors. --- ### 4. Comparison of Attachment Types | Method | Security | Ease of Removal | Thermal Performance | | :--- | :--- | :--- | :--- | | **Adhesive Tape** | Low | Hard | Moderate | | **Push-Pin (ATS-10D)** | **High** | **Easy** | **High (due to pressure)** | | **Wire Clip** | High | Moderate | High |