The **ATS-10D-26-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its electronic and physical specifications. --- ### 1. Technical Specifications This part belongs to the **pushPIN™** series, designed for easy installation and high thermal efficiency on Printed Circuit Boards (PCBs). | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-10D-26-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 14.20°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 70.00mm x 70.00mm x 10.00mm | --- ### 2. Key Components & Design The "C2" and "R0" designations in the part number refer to specific material and environmental compliance standards. #### A. Fin Profile (Fine-Pitch) The device uses a **fine-pitch** fin design. This maximizes the surface area for heat dissipation, making it ideal for high-velocity airflow environments within server racks or telecommunications equipment. #### B. Attachment Mechanism (pushPIN™) Instead of adhesive or simple clips, this part uses a precision spring-loaded mechanism: * **Compression Springs:** Ensure even pressure across the heat source (CPU/GPU/FPGA). * **Plastic/Brass Push Pins:** Provide secure mechanical attachment to the PCB through pre-drilled holes. #### C. Thermal Interface Material (TIM) The "C2" suffix typically indicates that the part comes with **T766** pre-applied thermal phase-change material or a high-performance thermal grease, ensuring low thermal resistance between the component and the sink. --- ### 3. Thermal Performance Metrics The effectiveness of the ATS-10D-26-C2-R0 depends on the airflow (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 14.20 | 4.60 | 2.50 | --- ### 4. Applications * **Processors:** Cooling CPUs, GPUs, and FPGAs in industrial computing. * **Power Electronics:** Thermal management for high-capacity power supplies. * **Telecommunications:** Used in base stations and networking switches where space is limited but heat output is high.