The **ATS-10D-31-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for cooling critical components like CPUs, GPUs, or high-power transistors. --- ### Technical Specifications | Feature | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-10D-31-C2-R0 | | **Material** | Aluminum (AL6063) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 25.25°C/W (Unducted Flow @ 100 LFM) | | **Fin Type** | Straight | | **Fin Pitch** | Coarse | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### Key Electronic & Physical Components #### 1. Heat Sink Body The body is constructed from **Aluminum 6063**, which is preferred in electronics for its high thermal conductivity and lightweight properties. The fins are arranged in a **straight-fin** configuration to allow air to pass through and carry away heat generated by the semiconductor. #### 2. pushPIN™ Attachment System Instead of using messy adhesives or bulky brackets, this part uses a precision spring-loaded mechanism. * **Compression Springs:** Ensure even pressure across the electronic chip to prevent cracking while maintaining optimal contact. * **Plastic/Brass Push Pins:** These snap into pre-drilled holes on the Printed Circuit Board (PCB). #### 3. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. In electronics, the TIM is critical because it fills microscopic air gaps between the heat sink and the component (like a processor), significantly improving heat transfer efficiency. #### 4. Blue Anodized Finish The "R0" suffix indicates a **Blue Anodized** finish. Anodizing is not just for aesthetics; it increases the surface emissivity and provides a layer of electrical insulation and corrosion resistance, which is vital for long-term PCB reliability. --- ### Dimensions (mm) | Dimension | Size | | :--- | :--- | | **Length (A)** | 57.90 mm | | **Width (B)** | 36.83 mm | | **Height (C)** | 10.00 mm | | **Pitch (E)** | 47.24 mm | --- ### Application in Circuitry This component is typically found in: * **Network Switches:** Cooling ASICs. * **Power Supplies:** Dissipating heat from MOSFETs. * **Embedded Systems:** Managing thermals for ARM-based processors.