The **ATS-10D-34-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). ### 1. Technical Specifications The part is designed for cooling electronic components such as CPUs, GPUs, or high-power transistors. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Attachment Type** | Push Pin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 14.33°C/W (Unducted Flow) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 35.00mm | --- ### 2. Key Components & Design Features #### A. Fin Design (Cross-Cut) The unit features a **straight fin** or **cross-cut** pattern. This design maximizes surface area while allowing airflow from multiple directions, which is critical for components that do not have a dedicated, single-direction cooling fan. #### B. The pushPIN™ Attachment System This part uses a specific mechanical attachment method: * **Push Pins:** These are spring-loaded pins that go through pre-drilled holes in the PCB. * **Compression Springs:** They provide precise pressure (preload) to ensure maximum contact between the heat sink base and the electronic chip. * **Reliability:** Unlike adhesive tapes, push pins are vibration-resistant and provide more consistent thermal performance over time. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of thermal interface material pre-applied to the base: * **ATS-PPS-04:** A high-performance thermal pad or grease is usually pre-applied to eliminate air gaps between the component and the heat sink. --- ### 3. Usage Context This heat sink is typically found in: * **Telecommunications:** Cooling high-speed signal processors. * **Embedded Systems:** Industrial PCs where vertical space allows for a 35mm tall sink. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. ---