The **ATS-10D-47-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and physical characteristics. ### 1. General Specifications The part number follows a specific nomenclature from the manufacturer, **Advanced Thermal Solutions (ATS)**, under their "Push-Pin" series. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-10D-47-C2-R0 | | **Type** | Board Level Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | --- ### 2. Thermal Performance Thermal resistance is measured based on the velocity of airflow (measured in Linear Feet per Minute - LFM). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 LFM (0.5 m/s)** | 9.30 | | **300 LFM (1.5 m/s)** | 4.49 | | **500 LFM (2.5 m/s)** | 3.52 | | **700 LFM (3.5 m/s)** | 3.01 | --- ### 3. Physical Dimensions The "47" in the part number typically refers to the height/profile of the fin array in the ATS catalog system. * **Length:** 25.00 mm * **Width:** 25.00 mm * **Height:** 25.00 mm (High profile for maximum surface area) * **Hole Spacing:** ~30.00 mm (Center to Center) --- ### 4. Key Component Features #### A. Fin Design (Straight Fin) The device uses a **straight-fin** pattern. This design is optimized for environments where there is a consistent, unidirectional airflow. The gaps between the fins allow air to pass through, carrying heat away from the base plate. #### B. Push-Pin Attachment Instead of using messy thermal adhesives or screws, this part uses a **plastic push-pin** with a compression spring. * **Springs:** Provide consistent pressure for better thermal interface contact. * **Ease of Install:** Requires pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The **"R0"** suffix usually indicates that the heat sink comes with a pre-applied **Phase Change Material (T766)** or a high-performance thermal pad on the base, ensuring immediate ready-to-use installation. --- ### 5. Common Applications * **Processors/FPGA:** Cooling small to medium-sized chips. * **Network Equipment:** Used in routers and switches. * **Embedded Systems:** Industrial PCs and automation controllers where space is limited but heat dissipation is critical.