The **ATS-10D-75-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling small to medium-sized integrated circuits (ICs) like BGA, FPGA, or CPU packages. --- ### ## Technical Specifications Below is a summary of the core electrical and mechanical specifications for this part: | Attribute | Specification | | :--- | :--- | | **Component Type** | Heat Sink (Passive Thermal Management) | | **Material** | Aluminum (Anodized Blue) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Fin Style** | Straight Fin (High density) | | **Thermal Resistance** | ~15.00°C/W (Unducted Flow @ 200 LFM) | | **Interface Material** | Pre-applied T766 (Thermal Interface Material) | --- ### ## Component Design Features #### 1. Push Pin Mounting Mechanism Unlike adhesive-based heat sinks, the "C1" variant uses a **push pin and spring** system. - **Reliability:** Provides constant pressure on the processor, ensuring optimal thermal contact. - **Serviceability:** Allows for easy removal and re-installation without damaging the PCB or leaving adhesive residue. - **Hole Pattern:** Requires pre-drilled holes in the PCB for installation. #### 2. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a phase-change or high-conductivity pad that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal impedance. #### 3. Material and Finish The heat sink is constructed from **Aluminum 6063**, which offers a balance of high thermal conductivity and low weight. The **Blue Anodized** finish is not just aesthetic; it protects against corrosion and improves radiative heat transfer. --- ### ## Thermal Performance Overview The efficiency of this part is highly dependent on the airflow (CFM) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 15.02 | | 400 (2.0 m/s) | 8.90 | | 600 (3.0 m/s) | 6.20 | --- ### ## Applications - **Networking:** Cooling switches and routers. - **Computing:** Secondary cooling for chipsets or small FPGAs. - **Embedded Systems:** Thermal management in industrial PCs where vibration resistance (via push pins) is required.