The **ATS-10D-76-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient heat dissipation in compact electronic systems. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-10D-76-C3-R0 | | **Heat Sink Type** | Fine Pitch (Straight Fin) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Thermal Resistance** | 27.50°C/W (Unducted) | --- ### 2. Physical Design & Features #### A. Fin Geometry The "76" in the part number indicates the specific fin design. This model features a **Fine Pitch** pattern, which provides a large surface area for heat exchange relative to its small 25mm footprint. This is ideal for high-speed components in cramped PCB environments. #### B. The pushPIN™ Attachment System Instead of using adhesive tapes which can fail over time, this part uses a mechanical **pushPIN™** system: * **Spring-loaded:** Ensures consistent pressure (TIM - Thermal Interface Material) against the chip. * **Plastic/Brass Pins:** Secure the heat sink into pre-drilled holes on the PCB. * **Vibration Resistance:** Mechanical fastening makes it more reliable in mobile or industrial applications compared to "clip-on" or "stick-on" solutions. #### C. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** The "R0" suffix indicates the finish. Anodizing protects the aluminum from corrosion and slightly increases emissivity for better radiative heat transfer. --- ### 3. Performance Characteristics (Airflow) Thermal performance is highly dependent on air velocity within the chassis: | Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 27.50 | 12.12 | 8.35 | 6.57 | 5.61 | --- ### 4. Application Use Cases This specific heat sink is typically found in: * **Microprocessors (CPUs):** Smaller ARM-based chips or embedded controllers. * **FPGAs & ASICs:** High-speed integrated circuits that generate localized heat. * **Telecommunications:** Networking switches or routers where vertical space (15mm height) is limited.