The **ATS-10D-79-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling components like CPUs, GPUs, and high-power chipsets. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Dimensions** | 25mm x 25mm x 30mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | | **Fin Style** | Straight Fin | | **Pressure Spring** | Stainless Steel | --- ## 2. Component Breakdown ### A. Material and Finish The heat sink is made of **extruded aluminum**. Aluminum is chosen for its high thermal conductivity and lightweight properties. The **Black Anodized finish** is not just for aesthetics; it increases the emissivity of the surface, which slightly improves heat dissipation through radiation. ### B. Attachment Mechanism (Push-Pins) The "10D" and "R0" designations often refer to the specific mounting hardware. * **Push-Pins:** These provide a secure, vibration-resistant attachment to the Printed Circuit Board (PCB). * **Spring-Loading:** The stainless steel springs ensure a consistent amount of downward pressure on the component, which is critical for maintaining effective thermal contact. ### C. Thermal Interface Material (TIM) This part comes with **T412** pre-applied. * T412 is a "phase change" or high-performance thermal pad. * It fills the microscopic air gaps between the heat sink base and the electronic chip, significantly reducing thermal resistance. --- ## 3. Performance & Use Cases ### Performance Metric The thermal resistance of this unit varies based on airflow (measured in Linear Feet per Minute - LFM): * **Unducted Flow:** Higher resistance. * **Ducted/Forced Air:** Significant temperature drop as air passes through the 30mm tall fins. ### Common Applications 1. **Telecommunications:** Cooling signal processors in routers or switches. 2. **Embedded Systems:** Industrial PCs where space is limited but vertical clearance allows for 30mm fins. 3. **Power Electronics:** Cooling MOSFETs or power regulators. --- ## 4. Part Number Decoding (Typical ATS Logic) | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **10D** | Series/Mounting Style (Push-Pin type) | | **79** | Specific size/geometry identifier | | **C3** | Material/Finish code (Black Anodized) | | **R0** | Revision or specific hardware kit configuration |