ATS-10D-90-C2-R0
AI

The **ATS-10D-90-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions** | 45mm x 45mm x 25mm |
| **Attachment Type** | Push Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 6.36°C/W (at 200 LFM) |
| **Fin Style** | Straight Fin |
| **Thermal Interface Material (TIM)** | T766 (High Performance) |
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### 2. Design and Component Breakdown
#### A. Fin Geometry
The "Straight Fin" design is optimized for **forced air convection**. The vertical fins allow air from a system fan to pass through easily, stripping heat away from the aluminum base.
#### B. The Push Pin Mechanism
Unlike adhesive tapes or clips, this model uses a **mechanical push pin** system:
* **Ease of Install:** Requires pre-drilled holes in the PCB.
* **Constant Pressure:** The brass pins and springs ensure uniform contact pressure between the heat sink and the electronic chip, which is critical for heat transfer efficiency.
#### C. Thermal Interface Material (TIM)
The part number suffix **"C2"** indicates it comes pre-applied with **T766** thermal grease. This eliminates the need for manual paste application and ensures there are no air gaps between the component and the heat sink.
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### 3. Applications
This part is typically used in the following electronic environments:
* **Networking Hardware:** Switches and Routers.
* **Industrial PCs:** Controllers that generate significant heat in compact spaces.
* **Power Supplies:** Cooling voltage regulators or power transistors.
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### 4. Part Number Decoder
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer: Advanced Thermal Solutions |
| **10D** | Series/Product Family (Push-pin type) |
| **90** | Height/Design variant |
| **C2** | Thermal Interface Material (T766) |
| **R0** | RoHS Compliant / Revision code |
- ⤷
What is the hole pattern dimensions required on the PCB for this heat sink?
- ⤷ How does the T766 thermal material compare to standard silicone-based pastes?
- ⤷ What are the air flow requirements to achieve maximum thermal efficiency?